Electrical and electronic components

Increase productivity with better process control

• Component reliability assurance
  – Simultaneous solder alloy composition
  and thickness measurement
• Lifetime product assurance through
  optimised quality control
  – Analysis of gold and palladium
  thickness of electrical contacts
  – Coating thickness of NiP layer on´
  computer hard disc
• Analysis of very thin coatings
  (e.g. Au/Pd coatings of < 0.1 μm)

Compliance and Metals Testing

Metal Finishing

Minimise production cost of the plating process
and maximise production output

• Speed and simplicity of analysis
  – Simultaneous single or multi elements
  coating thickness analysis and coating
  composition
  – Analysis of up to 4 layers (plus substrate
  – Plating bath analysis
  
  
  

High Reliability

RoHS/WEEE/ELV* compliance testing

Improve quality control to ensure products meet specifications

• Determination of hazardous substances from parts per million
  to high percent levels
• Quantification of toxic elements e.g. Cd, Hg, Pb etc. to verify
  compliance

*) Restriction of Hazardous Substances/
Waste Electrical and Electronics
Equipment/End of Life vehicles (directives)

Alternative Energy

Solar panels and fuel cells Ensure product efficiency and uniformity Composition analysis of the thin-film absorber layer (e.g. CIS, CIGS, CdTe) in thin-film photovoltaic cells Optimise electrical conductivity through layer thickness analysis

Metal alloy composition and identification

Rapid, non-destructive analysis of jewellery and other alloys

• Precious metal alloy assay
• Karat analysis
• Material identification
• Quantification of impurities